Director, Assembly Engineering

Rochester Electronics, LLC seeks a Director, Assembly Engineering to work in Newburyport, Massachusetts. Will lead the assembly engineering function with responsibilities for establishing new package technology capabilities, developing organizational skills/knowledge, implementing/driving the assembly engineering organization to meet package qualification timelines along with driving continuous operational improvement in yield, cost, productivity, and cycle time metrics.

Duties:

• Implement package and assembly technology roadmap per the company's timelines, identify capabilities for people, equipment, methods, and materials, and outline cost and cycle time expectations.
• Provide strategic and technical leadership in the development of New Product Introduction (NPI) solutions by using 8D, defect mapping, FMEA, and other analytical processes to solve complex problems impacting performance, cost, quality and yield within the product engineering, test engineering and characterization domains.
• Direct NPI assembly operation engineering team member activities with overall responsibility of developing APQP systems, staffing, planning, budgeting, managing expense priorities, performance management, and working through functional group to achieve results.
• Develop and build capable and scale-able Assembly and Package Engineering Teams that drive profitable manufacturing from low or high-volume order.
• Execute new product launches including customer presentation, internal training, technical collateral, press material, and cost pricing.
• Establish production qualification and control plans.
• Mentor subordinates in working knowledge of all aspects of semiconductor packaging technology and manufacturing, including wafer fab technology, package technology, assembly equipment and materials.
• Review existing assembly methodologies, such as FMEA and technical risk, architectures and design rules and implement updates to improve assembly coverage/quality along with optimizing productivity.
• Interface with Design, Assembly, Test, Operations and Quality on the development, and technology alignment for upcoming package and product needs.
• Collaborate across organization boundaries and frequently interact with design, operations, supply chain, sales, assembly, test, and quality teams.
• Support efforts by defining, developing, executing, and reporting assembly qualification plans and specifications covering: Interoperability, Reliability, Functionality, Robustness, Performance, and Compliance.
• Communicate internally to manufacturing and assembly stakeholders on the issues detected during production/qualification, and works to determine root cause and implement corrective action in a timely manner.
• Lead cross functional teams in developing advanced packaging process solutions on datamation/automation/effective projects, and ensure new process, new equipment, new material and path finding activities success for BGA, QFN, and Flip Chip in Rochester.
• Drive new product introduction rollouts based on POR which indicates overall schedule of the key activities from package design and development, product validation, process characterization, qualification, to production release.
• Perform root-analysis of the business-critical process, product, and material issues, often in collaboration with customers and vendors.
• Work cross functionally across other Rochester departments to support sales and after sales support of Rochester goods and services.
• Provide training within department as well as to other departments on assembly tools, techniques, capabilities and marketing of our capabilities.
• Perform characterization and optimization to support new product introduction and meet cost target through yield improvement and cost reduction activities.

Job Requirements:

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, or related engineering discipline or an equivalent foreign degree and 10 years of engineering experience in semiconductor manufacturing, with at least 5 years in a leadership position with demonstrable leadership skills. Required experience must include the following:

• Broad knowledge of equipment and material used in semiconductor assembly operations and quality testing, including die/wire bonding, wafer back grinding, sawing, molding, ball mount, marking, and singulation, for both lead frame and substrate-based products.
• Demonstrable knowledge of applied statistical and data analysis techniques, including MS Excel data visualizations, DMAIC and SAS JMP.
• Demonstrable expertise in 8D, failure analysis (SEM (EDX), FIB, FTIR, 3D x-ray and optical microscopy), reliability testing (TC, HTS, thermal aging, shock), RCA, design of experiment, FMEA, control plans, OCAP, SPC, 5S, and Kaizen.
• Previous experience with BGA's (ball grid array), QFN (quad flat no lead), and FC (Flip chip), equipment technology such flip chip die bonder, cu wire bonder, auto mold system, solder ball mounter, and laser mark technology, plus direct material technology such as green compound, copper wire, pure tin and lead solder balls.
• Previous experience in automotive chip making, and copper and gold bonding.
• Lead Six Sigma expert evidenced through experience.
• Exceptional written and verbal communication skills, relationship building, and in making presentations.
• Previous experience in mentorship, coaching, and human capital development greatly.
• Represent, support, and encourage the Rochester culture, as well as ensures their team follows work practices, specs and policies set forth by the company.
• Travel up to 40% within the U.S. and international travel, if needed.

Apply at:https://www.rocelec.com/about/careers