Hardware Engineering - Hardware Engineer IV Hardware Engineer IV
Apply NowCompany: PRI Global, Inc.
Location: Sunnyvale, CA 94087
Description:
Job Description: Location: CA - Sunnyvale - Remote
BR: Max ***
Responsibilities:
Design of semiconductor packages and modules for AR/VR Silicon.
Design feasibility studies based on electrical performance and form factor requirements.
Support electrical extraction and SI/PI/PDN analysis on the package design.
Ideation of new architecture/ design concepts such as Client interfaces for Sensor-Compute etc
Skills:
Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
1. Cadence (APD/PCB Designer/OrCAD)
2. Mentor (Hyperlynx/Expidition)
3. HFSS
4. ANSYS
5. Sigrity
Education/Experience:
Bachelor's degree in engineering required.
Pursuant to the California Fair Chance Act, Los Angeles County Fair Chance Ordinance for Employers, Los Angeles Fair Chance Initiative for Hiring Ordinance, and San Francisco Fair Chance Ordinance, qualified applicants will be considered for assignment with arrest and conviction records. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness, meet client expectations, standards, and accompanying requirements, and safeguard business operations and company reputation
Comments for Suppliers:
BR: Max ***
Responsibilities:
Design of semiconductor packages and modules for AR/VR Silicon.
Design feasibility studies based on electrical performance and form factor requirements.
Support electrical extraction and SI/PI/PDN analysis on the package design.
Ideation of new architecture/ design concepts such as Client interfaces for Sensor-Compute etc
Skills:
Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
1. Cadence (APD/PCB Designer/OrCAD)
2. Mentor (Hyperlynx/Expidition)
3. HFSS
4. ANSYS
5. Sigrity
Education/Experience:
Bachelor's degree in engineering required.
Pursuant to the California Fair Chance Act, Los Angeles County Fair Chance Ordinance for Employers, Los Angeles Fair Chance Initiative for Hiring Ordinance, and San Francisco Fair Chance Ordinance, qualified applicants will be considered for assignment with arrest and conviction records. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness, meet client expectations, standards, and accompanying requirements, and safeguard business operations and company reputation
Comments for Suppliers: