IC Package Design Integration Engineer
Apply NowCompany: Qualcomm
Location: San Diego, CA 92154
Description:
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
The ever-increasing requirement for data and processing bandwidth driven by the growth 5G networks, autonomous driving vehicles and carrier service scaling are creating technology demands which discrete component designs are struggling to address. Heterogeneous integration of chips and devices with high density interconnect module designs have the promise to address these technology challenges and create a new system design paradigm.
We are looking for an experienced multi-chip packaging integration lead who has the passion to help lead this effort. The person should possess knowledge for wafer bump, assembly, substrate technology, material trends and flip-chip package designs and will be able to lead cross multiple disciplines to address the technology challenges.
**Position requires to be in San Diego full time
Responsibilities include, but not limited to:
-Explore and recommend the packaging solutions and define POR for QCOM's multi-chip module designs
-Facilitate product package risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield
-Coordinate technical development for new design attributes across partner teams from design to manufacturing (bump and assembly process and substrate technology)
-Drive DFM/DFR/DFT, and TV design to identify the critical process window and material attributes.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$127,200.00 - $190,800.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
The ever-increasing requirement for data and processing bandwidth driven by the growth 5G networks, autonomous driving vehicles and carrier service scaling are creating technology demands which discrete component designs are struggling to address. Heterogeneous integration of chips and devices with high density interconnect module designs have the promise to address these technology challenges and create a new system design paradigm.
We are looking for an experienced multi-chip packaging integration lead who has the passion to help lead this effort. The person should possess knowledge for wafer bump, assembly, substrate technology, material trends and flip-chip package designs and will be able to lead cross multiple disciplines to address the technology challenges.
**Position requires to be in San Diego full time
Responsibilities include, but not limited to:
-Explore and recommend the packaging solutions and define POR for QCOM's multi-chip module designs
-Facilitate product package risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield
-Coordinate technical development for new design attributes across partner teams from design to manufacturing (bump and assembly process and substrate technology)
-Drive DFM/DFR/DFT, and TV design to identify the critical process window and material attributes.
- Hands-on experience with Cadence APD/SIP or Mentor Expedition/Xpedition
- Good EE fundamentals and solid signal and power integrity fundamentals
- Experience/knowledge in the packaging technology including substrate, bump and assembly process Experience in package design, design for manufacturing review
- Familiar with layout review tools such as Valor or Calibre
- Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is a plus
- Excellent communication and organizational skills
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$127,200.00 - $190,800.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.