Principal Packaging Engineer
Apply NowCompany: Hyperlume Inc.
Location: Ottawa, ON K1A 0A5
Description:
PRINCIPAL PACKAGING ENGINEER
Hyperlume is a semiconductor company with a mission to transform data center connectivity with the world's fastest and most energy-efficient microLED-based interconnects. With AI models exceeding 1 trillion parameters and training clusters of more than 100,000 GPUs, higher levels of connectivity, driven by higher bandwidth, lower latency and lower energy consumption are needed to reach AI's full potential and solve some of the world's most challenging problems. As the world enters this new era of artificial intelligence, Hyperlume is committed to developing cutting-edge connectivity solutions in months, not years.
Hyperlume is seeking a highly motivated and detail-oriented Principal Packaging Engineer to lead packaging and assembly processes for next generation MicroLED-based active optical cables (AOCs). This hands-on role focuses on advanced packaging techniques such as wire bonding, flip-chip bonding, and laser lift-off. The ideal candidate will work closely with front-end process engineers to ensure seamless integration between fabrication and packaging processes, leveraging advanced characterization techniques like SEM, AFM, and profilometry to validate outcomes and optimize device performance.
WHAT YOU'LL DO
Process Development & Optimization
Characterization & Testing
Process Monitoring & Troubleshooting
Cross-Functional Collaboration
REQUIRED QUALIFICATIONS
Education
Experience
Skills
HOW WE EVALUATE APPLICATIONS
COMPENSATION
$150,000 - $220,000 Canadian dollars, depending on experience.
The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full-time offers and are considered part of Hyperlume's total compensation package. Additionally, Hyperlume offers a competitive benefits program for full-time employees.
Hyperlume is an equal-opportunity employer committed to creating a diverse and inclusive workplace. The Hyperlume team is made up of incredibly talented and unique individuals, who together are dedicated to transforming the way vast amounts of data are transmitted, creating new paths towards the future of connectivity. All qualified applicants will be treated with respect and receive equal consideration for employment without regard to race, color, creed, religion, sex, gender identity, sexual orientation, national origin, disability, uniform service. We actively encourage members of recognized minorities, women, veterans, and those with disabilities to apply, and we work to create a welcoming and supportive environment for all applicants throughout the interview process. If you are someone passionate about working on problems that have a real-world impact, we'd love to hear from you!
Hyperlume is a semiconductor company with a mission to transform data center connectivity with the world's fastest and most energy-efficient microLED-based interconnects. With AI models exceeding 1 trillion parameters and training clusters of more than 100,000 GPUs, higher levels of connectivity, driven by higher bandwidth, lower latency and lower energy consumption are needed to reach AI's full potential and solve some of the world's most challenging problems. As the world enters this new era of artificial intelligence, Hyperlume is committed to developing cutting-edge connectivity solutions in months, not years.
Hyperlume is seeking a highly motivated and detail-oriented Principal Packaging Engineer to lead packaging and assembly processes for next generation MicroLED-based active optical cables (AOCs). This hands-on role focuses on advanced packaging techniques such as wire bonding, flip-chip bonding, and laser lift-off. The ideal candidate will work closely with front-end process engineers to ensure seamless integration between fabrication and packaging processes, leveraging advanced characterization techniques like SEM, AFM, and profilometry to validate outcomes and optimize device performance.
WHAT YOU'LL DO
Process Development & Optimization
- Develop and refine back-end packaging processes, including wire bonding, flip-chip bonding, and laser lift-off for substrate removal.
- Collaborate with front-end process engineers to align packaging workflows with fabrication requirements and optimize device integration.
- Address challenges related to thermal management and ensure robust interconnect solutions for high-density MicroLED arrays.
Characterization & Testing
- Perform detailed characterization of packaged devices using tools such as SEM, AFM, and profilometers to assess surface morphology, material integrity, and dimensional accuracy.
- Analyze characterization data to drive process improvements and troubleshoot defects.
- Establish protocols to validate process outcomes and ensure compliance with device design specifications.
Process Monitoring & Troubleshooting
- Implement and maintain statistical process control (SPC) systems to monitor packaging processes and identify deviations.
- Lead root cause analyses of defects related to packaging and assembly, developing corrective and preventive actions (CAPA).
- Collaborate with cross-functional teams to resolve process and equipment-related challenges.
Cross-Functional Collaboration
- Partner with front-end engineers, R&D teams, and quality assurance to integrate new materials and devices into packaging workflows.
- Provide technical guidance and training to production staff on packaging techniques and characterization protocols.
REQUIRED QUALIFICATIONS
Education
- BSc, MSc, or Ph.D in Electrical Engineering, Materials Science, Physics, or a related field. Specialization in MicroLED, LED, or optoelectronic packaging or device characterization is preferred.
Experience
- Minimum of 3 years of hands-on experience in back-end semiconductor processing, including packaging techniques such as wire bonding, flip-chip bonding, and laser lift-off.
- Proficiency in imaging and characterization tools such as SEM, AFM, and profilometers.
Skills
- Deep knowledge of packaging processes and their integration with front-end fabrication workflows.
- Expertise in characterization techniques for validating process outcomes and identifying defects.
- Familiarity with SPC, DOE, and data-driven optimization methods.
- Strong problem-solving skills and ability to work collaboratively in multidisciplinary teams.
- Excellent documentation and communication skills to support cross-functional collaboration.
HOW WE EVALUATE APPLICATIONS
- Merit: A proven track record of excellence in electro-optical systems, with hands-on expertise in optical system design and PCB integration.
- Excellence: A relentless drive to deliver high-quality solutions that redefine industry standards.
- Intelligence: A deep understanding of optical communication technologies and a hunger for continuous learning and innovation.
COMPENSATION
$150,000 - $220,000 Canadian dollars, depending on experience.
The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full-time offers and are considered part of Hyperlume's total compensation package. Additionally, Hyperlume offers a competitive benefits program for full-time employees.
Hyperlume is an equal-opportunity employer committed to creating a diverse and inclusive workplace. The Hyperlume team is made up of incredibly talented and unique individuals, who together are dedicated to transforming the way vast amounts of data are transmitted, creating new paths towards the future of connectivity. All qualified applicants will be treated with respect and receive equal consideration for employment without regard to race, color, creed, religion, sex, gender identity, sexual orientation, national origin, disability, uniform service. We actively encourage members of recognized minorities, women, veterans, and those with disabilities to apply, and we work to create a welcoming and supportive environment for all applicants throughout the interview process. If you are someone passionate about working on problems that have a real-world impact, we'd love to hear from you!