Product Development Engineer

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Company: XFab

Location: Lubbock, TX 79424

Description:

Job Details

Level
Experienced

Job Location
TX - Lubbock, TX

Position Type
Full Time

Education Level
Graduate Degree

Travel Percentage
Negligible

Job Shift
Any

Description

Job Function:

The Product Development Engineer is responsible for defining new module exploration and development, new technology exploration and development, all new SiC process requirements, the formal release of all new SiC process and module offerings, within X-Fab Texas. Duties include working directly with SiC customers & The Functional departments within the X-FAB Texas organization to assure standards of excellence are established and maintained as well as ensure that the systematic and infrastructural components to new technological developments are in place.

Additionally, the Product Development Engineer must continue to support Process Integration as both new process that are integrated into XFAB as well as technical issues concerning continual improvement. With the combined knowledge of device physics, device design, and material processing, the Product Development Engineer maintains a unique perspective to aid in scrap reduction, yield improvement and overall identification and implementation of best practices of semiconductor processing techniques.

Responsibilities:
  • Create and maintain a strategic technological advances:
    • Maintains X-FAB's standing as the leader in SiC foundry services
    • Ensure timely and barrier free transition for customer access to new module and technology offerings
    • Maximizing profit potential for high margin services/offerings
    • Team oriented with all major X-Fab internal customers (Mask Tooling, IT, Process Engineering, Process Integration, Yield Enhancement etc.)
  • Provides technical direction for the requirements, design, characterization and integration of X-Fab's SiC module and technology offering
  • Establish w/ functional departments a system for module/technology onboarding and streamlined implementation
  • Write proposals for new module and technology development and associated equipment needs, etc. to outline coast and projected ROI
  • Owns the development lifecycle and is responsible for managing technical risks
  • Consistently delivers high-quality services to our internal and external customers.
  • Utilizing inputs from customers and technical conferences, continually refine X-FAB's SiC Module and Technology roadmap to stay as the benchmark of the industry
  • Identify opportunities for X-FAB IP development
  • Manufacturability of SiC Processes and Process Block flows for both modules and new technologies.
  • Working with the Process Engineering Team & our customers ensure:
    • All new processes and or applications where manufacturability is a potential issue are identified
    • Our processes are manufacturable prior to release

Current Skills/Competencies Required:
  • In-depth technical knowledge of the SiC discrete process and business goals as well as other technological areas not typically/currently associated with SiC in industry such as CMOS
  • Strong device physics understanding for Si as well as WBG materials.
  • High level of knowledge concerning WBG material processing.
  • Strong understanding of both material and electrical characterization methods and data preparation and analysis.
  • Understanding of PCM design and test routines
  • Ability to create and publish design rules and aid in DRC creation
  • Be proficient in design architectures for various technology types as well as the layout tools required to implement designs
  • Strong written and verbal communication skills.
  • Excellence interpersonal skills
  • Goal-oriented & deadline-driven, and the ability to identify and solve problems as they arise.
  • Must have strong budgeting and scheduling skills,
  • Be proficient in word processing, spreadsheet programs, statistical analysis tools, PowerPoint.


Qualifications

Minimum Requirements:
  • M.S. / Doctor of Philosophy in Electrical Engineering, Physics, Material Science or related field.
  • 5 yearsexperiencein the field ofsemiconductordevelopment. Graduate school may count asequivalentyearsexperiencedepending on theapplicant'sarea of emphasis.

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