Senior Advanced Packaging Engineer

About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems the electronic switch. Menlo Micros technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worldswithits IdealSwitch.

Are you interested in playing a critical, impactful role andworkwithtop electronic systems talentatan exciting startup backed by industry leaders? Do you wanttohelp create truly disruptive and unique products thatwillchange markets? If you answered yestoboth, this may be your opportunitytohave a significant impactata cutting-edge startupwithindustry-leading technology thatwilldrive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

Youwilldrive the thermal-mechanical design, new package and assembly process development and production package optimization for Menlo Micros diverse power and RF products that use our innovative MEMS switch technology.In this role youwillbe theleadengineer ensuring technical attainment of all design and qualification requirements, including characterization and reliability testing, and participate in the timely release-to-production.

Youwilldirectlyimpact critical roadmaps andsupportnew technology developments.Projectswillencompass design, characterization, packaging, thermal / mechanical considerations, assembly, mechanical test strategy, data analysis, reliability testing, root cause problem solving, and material dispositioning.

Essential Responsibilities

This is a hands-onrole, and key responsibilities include:

• Device substrate, package, and module design & Design for Manufacturability (DFM) of MEMS-basedRF and power switch products
• Effective material, process and component design and selectionbasedonthorough thermal, mechanical and stress analysis
• Mechanical design and simulation of microelectronic packages and assemblies
• Package technology roadmap definition and execution for modules and packaging aspects of Menlo Micros product lines
• Assessment and integration of 3D Heterogeneous packaging strategy
• 3D modeling for Menlo Micro packages, modules and assemblies
• Characterization and reliability stress testing of both die, package and module-level products
• Design verification of Coefficient of Thermal Expansion (CTE) thermal impedance, and associated stresses
• Material selection for mechanical parts and attachments
• Solder stress modelingonpackages and modules
• Timely qualification and production launches
• Data analysis, dispositions, and associatedreports
• Development and deployment of comprehensive design verification test capabilities that ensure compliancetospec.
• Workwiththe technology teamtoenhance and validate new technologies, device structures, and design rules
• Workwiththe test development teamtodrive pre-production yield enhancements, reliability and test methodology improvements
• Provide feedback into next generation product specifications and development

Qualifications and Requirements

• Deep and thorough understanding of microsystem package design, characterization, qualification and reliability requirements
• Experiencewithpower module development through product manufacturing deployment
• Demonstrated abilitytodrive thorough new package verification and validation procedures
• Demonstrated sound DOE practices
• Demonstrated abilitytoinvestigate, find root cause, and implement appropriate corrective actions using statistical data analysis methods across a broad range of disciplines including device physics, fabrication, test methods, product specifications and product reliability
• Strongworkingknowledge of statistical data analysis tools and scripting languages
• Workdirectlyand interactivelywithmultidisciplinary engineering team and customers to define and implement effective package and module product solutions
• Abilitytodesign and simulate effective thermal solutions for products
• BS,MSorPhDin mechanical engineering, physics, or electrical engineeringwithaminimum5yearsof experience
• Abilitytoworkin a multi-disciplinary team environment
• Willingnesstotravelupto10% of thetime
• Must be US person per ITAR regulations
• Desiredworklocationis Albany, NY or Irvine, CA

DesiredCharacteristics

• Experiencewithadvancedpackaging technologies
• Experience in aerospace and defense industry
• Experiencewithheat pipes, liquid cooling and otheradvancedthermal management technologies for power electronics
• A critical problem solver and innovator
• Expertise in SolidWorks software
• Subject matter expertise in CFD analysis
• Excellent communication skills
• Experiencewithpower package technologies
• Familiaritywithpower relays and protection devices
• Provide mentorship to junior mechanical engineers
• ExperiencewithAC and DC power systemsatratings upto1kV and 1000A
• Aworkingunderstanding of MEMS or semiconductor device design and fabrication.

Salary

DOE