Senior Photonics Packaging Engineer

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Company: Taara Connect, Inc

Location: Sunnyvale, CA 94087

Description:

About the Team:

Born at X, Google's Moonshot Factory, Taara is on a mission to connect billions of people lacking abundant and affordable internet today by pioneering the way we use light to deliver faster, cheaper, more reliable connectivity. Lead the charge in bringing our groundbreaking wireless optical communication and photonics chip technologies to the world. Drive our growth story as we scale innovative solutions across the world. Join us to light the way for bridging the digital divide and illuminating the future.

About the Role:

The successful candidate will design and implement packaging solutions for micro-optic assemblies of Si photonic and III-V dies at outsourced semiconductor assembly and test vendors. The role requires deep knowledge in photonic packaging design, simulation, optimization, assembly and testing. The position seeks highly-motivated individuals who thrive in ambiguity and enjoy working in a small dynamic team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology.

How you will make 10x impact:
  • Develop and implement novel photonic assembly and packaging.
  • Optimize assemblies for manufacturability and reliability.
  • Contribute to system-level optimization and product strategy.
  • Be motivated by making the world a better place through technology, and wanting to be part of a team that makes this happen.

What you should have:
  • M.S. in Electrical Engineering, Applied Physics or related field
  • Five (5) or more years relevant industry experience with demonstrated achievements in photonic packaging
  • Experience with optical simulation software (Zemax, Lumerical, Flexcompute or equivalent)
  • Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent).
  • Experience with optimization of packaging towards manufacturability and reliability.
  • Experience working with outsourced semiconductor assembly and test vendors.
  • Experience with failure analysis, parts inspection and testing.

It would be great if you also had these:
  • Ph.D. in Electrical Engineering, Materials Science, Applied Physics or related field
  • Experience with microelectronic assembly processes such as 3D and 2.5D assemblies
  • Excellent communication and presentation skills (writing and delivering presentations), can work with senior external partners with ease.
  • Hands-on experience in advancing product from prototype to final production stage


The US base salary range for this full-time position is $185,000 - $225,000 + bonus + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.

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