Staff Integrated Circuit (IC) Packaging Engineer

STAFF INTEGRATED CIRCUIT PACKAGING ENGINEER

JOB SUMMARY

As a Staff Integrated Circuit (IC) Packaging Engineer, you will have the manufacturing responsibility for our portfolio of RFIC devices and multi-chip modules (MCMs). This role requires a highly experienced IC assembly expert who has successfully deployed microelectronics and IC assembly solutions, with a focus on plastic over molded and cavity package assemblies, in a high mix, low volume environment. This is a key role in the Engineering team which is suitable for someone who is hands-on, collaborative, results oriented and with a proven track record of technical leadership.

This role reports directly to the Director of Engineering.
ESSENTIAL DUTIES AND RESPONSIBILITIES

• Lead and own the design, setup, qualification and release to production of low-volume, in-house assembly required for RFIC chip scale packaging of our MMIC devices, multi-chip modules and air cavity QFNs.
• Select the appropriate equipment sets, tooling and consumables. Conduct technical assessments, drive equipment selection and buy off activities of all assembly equipment, and proactively determine if existing assembly equipment can be used.
• Work with internal stakeholders to establish appropriate equipment buy-off criteria, qualification plans and production release criteria.
• Develop end-to-end package assembly processes required for RFIC chip scale packaging of our MMIC devices, multi-chip modules and air cavity QFNs. Document processes and train equipment technicians and manufacturing teams.
• Develop and release to production robust assembly processes that support highest yield, lowest cost, and best efficiency through the lifecycle of the product.
• Optimize machine and process efficiency; equipment maintenance and repair; equipment programming and optimization; lot setup, calibration, and troubleshooting issues.
• Design lead frames and packages that are compatible with automated equipment and processes.
• Continually improve manufacturing methods utilizing knowledge of product design and materials, fabrication processes, automated equipment, and quality standards.
• Provide technical leadership in solving production quality issues for MCMs and IC packaging.
• Perform root cause analysis and resolution of issues during both the development and production phases.
• Partner with design, quality, and reliability engineering teams to determine appropriate qualification testing strategies that ensure highest reliability of our product families in their end applications.
• Build on established engineering practices that support lean manufacturing techniques.
• Mentor junior engineers and lead technical development efforts across packaging and assembly disciplines.
• Promote an ethics-based business culture in the organization.

REQUIREMENTS

• BS or MS in Mechanical Engineering, Electrical Engineering, Materials Engineering or other applied engineering disciplines.
• 10+ years of professional experience in microelectronics assembly and packaging with a focus on IC plastic over mold packages.
• Successfully deployed automation previously for Chip Scale Packages, Air Cavity QFNs, and MCMs.
• Experience with RF components is a strong plus.

TECHNICAL COMPETENCIES

• In-depth, hands-on experience with automated assembly equipment and processes for RFIC packaging, including die attach, wire bonding, plastic over molding, deflash, singulation, dicing saws, laser engraving, underfill, epoxy dispense, epoxy die attach, solder die attach, and flip chip.
• Experienced in production automation methodologies.
• Familiarity with package laminates.
• Designing tooling/fixturing for IC package assembly automation.
• Demonstrated ability to work independently and be flexible to changing priorities, provide technical leadership and mentor younger engineers.
• Design of Experiments (DOE) & statistical process control experience required.
• Excellent data analysis skills and a logical approach to problem solving.
• Continuous improvement mindset within the organization.
• Strong oral and written communication skills. Able to effectively present information and respond to questions from management, peers, and customers.
• Highly proficient in a Windows environment and with a recent version of MS Office, including Word, Excel, PowerPoint, Outlook.
• 2D or 3D CAD experience using Solidworks is a plus.
• Outstanding work ethic and commitment to organizational success.
• This role requires the candidate to be 100% on-site.

CORE COMPETENCIES

• Business Acumen: Awareness and knowledge of and insight into the organization's vision, structure, culture, philosophy, operating principles, values, and code of ethics; ability to apply this understanding appropriately to diverse situations. Knowledge, insight, and understanding of business concepts, tools, and processes that are needed for making sound decisions in the context of the company's business; ability to apply this knowledge appropriately to diverse situations.
• Change: Knowledge of and ability to align the organization's people and culture with changes in business strategy, organizational structure, technology and business processes.
• Communication: Successful communication involves five components. Verbal communication refers to your ability to speak clearly and concisely. Nonverbal communication includes the capacity to project positive body language and facial expressions. Written communication refers to your skillfulness in composing text messages, reports, and other types of documents. Visual communication involves your ability to relay information using pictures and other visual aids. Active listening should also be considered a key communication skill because it helps you listen to and hear what others say. You need to be able to listen to understand how to best communicate with someone.
• Strategic Thinking: Understands business issues and opportunities and translates or aligns them to a vision, strategy and plans to chart a course of action.
• Teamwork: Collaborate with others to achieve common goals. Build strong, positive working relationships with supervisor and team members/coworkers. Exercise the ability to compromise and be adaptable.
• Problem-Solving / Critical Thinking: Ability to balance the needs of different people in a solution to a problem. Able to meet the needs of different constituents in the solution of a problem. Able to solve problems with multiple criteria that need to be met. Identifies and assesses all potential responses to a problem.
• Integrity / Work Ethic: Deal with Conflict Properly. Report Unethical Behavior. Be upfront about your short comings. Be willing to do hard work. Take accountability for your actions. Be a team player. Respect others. Don't abuse your power. Keep morale up.
• Interpersonal Skills: Interpersonal competencies help you interact, communicate, and collaborate with others effectively. Typical examples of interpersonal skills include empathy, active listening, and emotional intelligence.