Thermal Mechanical Engineer
Apply NowCompany: Foxconn Assembly LLC
Location: Houston, TX 77084
Description:
Responsibilities:
- Work on R&D, perform thermal solutions with specifications, analytical and computational analysis, designs and characterizations including CFD simulations and CAD designs, along with laboratory validations of prototypes and manufacturing implementations from chip-to-board level thermal solutions through focus on system level to deliver innovative, compliant and commercially viable server products to the marketplace in a timely and cost-effective manner.
- Collaborate with cross-functional product development teams and overseas partners to meet reliability, power efficiency, system performance, and cost requirements.
- Investigate new technology and designs during the product lifecycle of the project and drive design decisions; analyze/implement trade-offs while contributing to thermal solutions of product designs from conceptualizations to production.
- Compile test reports, summaries, and document investigations to contribute to insights into system layouts and product/solution improvements.
- Report analyses results and design specifics to internal management and external customers
- Minimum of a Bachelor's degree in an Engineering Discipline. An advanced engineering degree (MS or Ph.D.) with an emphasis on thermal sciences would be an added plus.
- Strong fundamental backgrounds in heat transfer and fluid mechanics, understanding of cooling techniques for electronic components and equipment, such as the passive and active heat transfer, air cooling, liquid cooling, two-phase immersion cooling, heat sinks, heat pipes, vapor chambers, and fans thorough graduate level course works or industry experiences.
- Knowledge of semiconductor, package, and PCB designs and thermal testing. Experience working with Integrated Circuit (IC) physical design parameters affecting electrical and thermal performance of packaging technologies. Thermal Mechanical Engineer
- Knowledge of thermal analysis and computational modeling, development of thermal solutions and methodologies at the server and system-level for semi-conductor products, data analysis and product characterizations, optimizations of thermal controls for increased quality and cost improvements, development of thermal management techniques
- Strong knowledge of CFD principles as well as working experience in creating analytical and numerical models using CFD tools such as FloTherm, ANSYS-IcePak, and Fluent, etc.
- Experience with defining thermal test plans, designing experiments on prototypes. Experiences in instrumentation, data acquisition, and data analysis, including uncertainty analysis. Experiences with various temperature, pressure, and fluid flow measurement techniques. Basic controls, automations, and acoustical knowledge are a plus.
- Some experience with 3D/2D models utilizing CAD tools such as PTC Creo or Pro/Engineer, or SolidWorks, etc., is a major plus.
- Good ability to visualize and clarify product needs from fundamental concepts through system considerations to ensure optimized designs.
- Good written and verbal communication skills, strong analytical and problem-solving ability, and effective teamwork throughout the organization