Regional Process Engineering Director

Summit Interconnect currently has an open position for a Regional Process Engineering Director. Summit Interconnect is a manufacturer of advanced technology printed circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications.

The Regional Process Engineering Director is responsible for operational excellence via efficient manufacturing design. Ensures continuous improvement in process, cost, quality, and production.

Qualifications: To perform this job successfully, an individual must have a minimum of ten (10) years in the printed circuit board industry and must be able to perform each essential duty satisfactory. The requirements listed below are representative of the knowledge, skill and/or ability required.

Responsibilities:

• Provide technical support to manufacturing as required.
• Manage and direct the daily functions of the Regional Process Engineering Group.
• Assign projects, establish realistic goals, and evaluate the results of the work activities of the Regional Process Engineering Group.
• Develop and document process controls to ensure product quality.
• Utilize Lean / SS approach to problem solving and develop capabilities of the team to identify root cause and implement corrective actions.
• Establish test methods, perform evaluations, and analyze results to assess existing technologies, products, and services.
• Implement tasks assigned by the General Manager / VP Operations.
• Provide technical input and informed judgment to the disposition of discrepant material/ product.
• Provide a challenging atmosphere to promote employee development and growth.
• Monitor and evaluate the performance, efficiency, and effectiveness of established processes and procedures.
• Develop plans and implement capital improvement projects to support technology, cost and capacity requirements.

General Performance Criteria:

• Process and product yields.
• Process control implementation.
• Effectiveness of line support.
• Accuracy of all procedures.
• Effectiveness in solving process problems.
• Communication and documentation of process activities.
• Efficiency, accuracy, and effectiveness of the Regional Process Engineering Group.

Education/Qualifications:

• Four Year Degree in Engineering, Science or related field or equivalent education and work experience.
• Minimum ten (10) years' experience in printed circuit board processes (preferred).
• Broad based experience in all aspects of multilayer PWB manufacturing.
• Ability to recognize and assess process technology requirements and develop strategic plans for integration.
• Excellent oral and written skills.
• Ability to interface in a positive manner with co-workers at all levels.
• Demonstrated ability to obtain, analyze, and make informed decisions utilizing data from various resources.

Compensation/Benefits: Summit offers a variety of health and benefit programs. Which include Medical, Dental, Vision, HSA plans, Hospital and Accident plans, Life Insurance, PTO, Matching 401K, and Paid Holidays. Benefits are effective 1st day of the month following date of hire.

Pay Range for this position is $175,000. - $225,000. annually based on experience.

Summit Interconnect is an Equal Opportunity/Affirmative Action Employer