Process Engineer, Senior

Company Overview:

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a directfield sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Company:MACOM Technology Solutions, Inc.

Location:2925 Broadwalk Drive, Ann Arbor, MI 48104

Position Title:Process Engineer, Senior (111269)

Job Description:

Design, develop, and qualify packaging for electronic and optical components. Involved with material selection, mechanical specifications, electrical and optical specifications. Work with external vendors to resolve various quality, component, and equipment issues. This position will require domestic travel up to 5% of the time to other MACOM sites, vendor, and possible customer interactions.

Job Requirements:

Requires a Masters degree in Electrical Engineering, Materials Science, or a directly related field plus five (5) years of experience in device packaging, specifically: (i) selection of materials for the package, components, and device assembly; (ii) development of processes for the use of those materials in device assembly; and (iii) testing of materials and devices for packaging requirements. Must have at least four (4) years of experience with the following: Experimental Design, Statistical Analysis, Failure Analysis, Reliability Testing, Creation of process documentation, Exposure to flip chip or wirebonding technologies, Microscopy, SEM and Material Analysis, Use of statistical analysis software. This position will require domestic travel up to 5% of the time to other MACOM sites, vendor, and possible customer interactions.