Senior Project Engineer

Senior Project Engineer

POSITION SUMMARY

Perform IC Assembly process development and improvement directly resulting in increased efficiency and quality on the production floorThis will be achieved through process documentation, operator training, and design of experiments.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE

• Assembly Engineering support for the Customer and Sales Group to review Customer requirements and determine the correct process and materials to meet those requirements.
• Daily interaction directly with customers with regards to technical issues and specification reviews.
• Manage and define Assembly Processes relating to specific Products and/or Customers.
• Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.
• Provide DOE, SPC, and yield reporting in a clear and presentable format.
• Collect Assembly yield data and perform yield analysis for production equipment and customer products.
• Generate detailed reports and specifications documenting all experimental and process findings and procedures.
• Assess existing processes and identify areas of improvement and solutions for these systems.
• Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.
• Conduct root cause analysis and corrective actions related to process failures.
• Identify and implement cost, quality, and yield improvements.
• Flexible to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE

Education: Bachelor's degree in engineering, Electrical, Mechanical, Material Science, or related field preferred.

Experience:

• Advanced understanding of the Semiconductor process.
• Minimum of 5 years of hands-on experience in Semiconductor Back End Process Engineering required.
• Minimum of 10 years of Assembly Process Engineering experience, preferred hands on in Die Attach, Wire Bond or Mold.
• Hands-on experience in wafer thinning, dicing, die attach, flip chip, and wire bonding required.
• Technical customer interface experience required.

Knowledge/Skills:

• Deep understanding of AutoCAD or SolidWorks required.
• Deep understanding of Engineering development process and activities.
• Statistical Process Control, Design of Experiments & FMEA experience are all highly desirable.
• Effectively and efficiently utilize Microsoft Office applications and other computer products and programs.
• Detail-oriented, data entry accuracy, problem solver, good analytical skills, team player, multitask capability.
• Effectively communicate with internal and external customers, both verbally and in writing, while maintaining and fostering collaborative, productive and trusting relationships throughout the organization.
• Goal-oriented self-starter with a sense of urgency that works well independently and in a team environment while prioritizing daily activities.