Sr. Product Design Engineer - Thermal Solution HW Design & Analysis
Apply NowCompany: Apple
Location: Cupertino, CA 95014
Description:
Summary
In this role, you will be a part of a highly talented team at the heart of thermal design utilizing your vast analysis and design experience to lead mechanical & thermal design and architecture efforts. There is a high level of visibility interfacing cross functionally. Candidate is responsible for driving thermal-mechanical solution, hardware architecture, performance analysis, system integration analysis, and verification testing. Will also provide guidance to cooling system design, system architecture, thermal and system product design teams for module performance and system integration considerations, etc.
Description
Develop system level model to optimize thermal module-SoC integration
Perform 2-phase flow heat-pipe & vapor chamber performance analysis, design and optimize the internal structures. Create FEA-CFD models for mechanical systems, perform static, dynamic and thermal-mechanical analyses in multi-physics environments
Develop thermal module-fan assembly design concept, architecture, structural and performance models to enable the best in class design. Collaborate with thermal design engineers to optimize thermal hardware performance. Participate in the development of new modeling methods to meet increasingly challenging new design requirements.
Your care in resolving engineering requirement specifications, communicating and receiving relevant feedback for design concepts/results with management will get noticed
Collaborate with vendors, tooling engineers and cross functional team to ensure that implementation is in line with design intent. Develop meaningful tests for new material and module design qualification. Review and interpret prototype testing to accurately validate design concepts. You will work with top tier fan, thermal module vendors to validate and solve problems in thermal design. Potential travel to Asia for factory builds and problem solving (up to 10%).
In this role, you will be a part of a highly talented team at the heart of thermal design utilizing your vast analysis and design experience to lead mechanical & thermal design and architecture efforts. There is a high level of visibility interfacing cross functionally. Candidate is responsible for driving thermal-mechanical solution, hardware architecture, performance analysis, system integration analysis, and verification testing. Will also provide guidance to cooling system design, system architecture, thermal and system product design teams for module performance and system integration considerations, etc.
Description
Develop system level model to optimize thermal module-SoC integration
Perform 2-phase flow heat-pipe & vapor chamber performance analysis, design and optimize the internal structures. Create FEA-CFD models for mechanical systems, perform static, dynamic and thermal-mechanical analyses in multi-physics environments
Develop thermal module-fan assembly design concept, architecture, structural and performance models to enable the best in class design. Collaborate with thermal design engineers to optimize thermal hardware performance. Participate in the development of new modeling methods to meet increasingly challenging new design requirements.
Your care in resolving engineering requirement specifications, communicating and receiving relevant feedback for design concepts/results with management will get noticed
Collaborate with vendors, tooling engineers and cross functional team to ensure that implementation is in line with design intent. Develop meaningful tests for new material and module design qualification. Review and interpret prototype testing to accurately validate design concepts. You will work with top tier fan, thermal module vendors to validate and solve problems in thermal design. Potential travel to Asia for factory builds and problem solving (up to 10%).