Thermal Design and Simulation Engineer
Apply NowCompany: Cornelis Networks
Location: Wayne, PA 19087
Description:
Cornelis Networks is a technology leader delivering purpose-built, high-performance fabrics accelerating Artificial Intelligence, High Performance Computing and High Performance Data Analytics workloads in the Cloud and in the Data Center.
The company's products enable customers to solve some of the world's toughest challenges by efficiently focusing the computational power of GPUs, or AI accelerators, at scale on a single problem. Whether pursuing faster time to train on the world's frontier models, providing scale out inference, driving scientific research, or building a commercial AI application specific to an industry our high performance fabrics will improve the performance, reliability and total cost of ownership of the solution.
Cornelis Networks is hiring talented Thermal Design and Simulation Engineer with experience in system and printed circuit board (PCB) development and design. The thermal engineer will be involved in the design of all phases of thermal management of high-performance electronics, from conception through end-of-life, of the next generation Cornelis Networks Fabric platforms.
Key tasks include:
Perform thermal simulation including modeling, pre/post-data processing and analysis
Work in lab with various equipment to perform thermal measurements, validation and qualification, and correlation of the measurements with the thermal simulations.
Provide design guidelines for platforms based on simulation and 3D modeling activities.
Complete platform designs and ensure that thermal management component and systems meet all required design criteria.
Work with mechanical, electrical design, software, system test, and manufacturing teams to assist in moving the product into production.
Minimum qualifications
Preferred qualifications:
Location:
This position is hybrid (on-site with some remote work possible) at the headquarters in the Chesterbrook Corporate Center in Wayne, PA. The successful candidate resides within commuting distance.
Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law.
The company's products enable customers to solve some of the world's toughest challenges by efficiently focusing the computational power of GPUs, or AI accelerators, at scale on a single problem. Whether pursuing faster time to train on the world's frontier models, providing scale out inference, driving scientific research, or building a commercial AI application specific to an industry our high performance fabrics will improve the performance, reliability and total cost of ownership of the solution.
Cornelis Networks is hiring talented Thermal Design and Simulation Engineer with experience in system and printed circuit board (PCB) development and design. The thermal engineer will be involved in the design of all phases of thermal management of high-performance electronics, from conception through end-of-life, of the next generation Cornelis Networks Fabric platforms.
Key tasks include:
Perform thermal simulation including modeling, pre/post-data processing and analysis
Work in lab with various equipment to perform thermal measurements, validation and qualification, and correlation of the measurements with the thermal simulations.
Provide design guidelines for platforms based on simulation and 3D modeling activities.
Complete platform designs and ensure that thermal management component and systems meet all required design criteria.
Work with mechanical, electrical design, software, system test, and manufacturing teams to assist in moving the product into production.
Minimum qualifications
- BS in Mechanical Engineering with concentration is thermodynamics and heat transfer.
- 3 yrs work experience or equivalent focused in thermal management of electronic components and printed circuit board assemblies.
- Ability to create computational fluid dynamic models (Cadence Celsius preferred) to analyze and optimize heat transfer for new applications.
- Conduct experiments to validate thermal models.
- Experience working with different heat transfer materials and methods, including both air and liquid cooling.
- MCAD design experience with competence in advanced industry standard modeling tools such as CREO (preferred) or SolidWorks.
- Experience writing documentation for assembly, methods and techniques related to heat transfer problems.
- Strong communication and interpersonal skills.
Preferred qualifications:
- The concepts of PCB layout, which may include experience with tools such as Cadence- Allegro, Mentor or similar tools.
- Experience with Python or other scripting languages.
- Experience with the use of NI data acquisition tools.
Location:
This position is hybrid (on-site with some remote work possible) at the headquarters in the Chesterbrook Corporate Center in Wayne, PA. The successful candidate resides within commuting distance.
Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law.