Advanced Packaging Integration Engineer
Apply NowCompany: Micron Technology
Location: Boise, ID 83709
Description:
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing cutting-edge processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the seamless transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is shaping the future of technology.
Position Overview:
Join Micron's Advanced Packaging Technology Development (APTD) team and be part of an innovative organization that drives strategic packaging initiatives critical to our future! As a Principal Advanced Packaging Integration Engineer, you will work on brand-new solutions and collaborate with industry experts to propel our high-performance products to new heights.
Responsibilities:
Minimum Qualifications:
Preferred Qualifications:
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing cutting-edge processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the seamless transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is shaping the future of technology.
Position Overview:
Join Micron's Advanced Packaging Technology Development (APTD) team and be part of an innovative organization that drives strategic packaging initiatives critical to our future! As a Principal Advanced Packaging Integration Engineer, you will work on brand-new solutions and collaborate with industry experts to propel our high-performance products to new heights.
Responsibilities:
- Develop and transfer technology in collaboration with process and design teams
- Design and tape out reticles, develop process flows, and secure resources, including wafers and processes
- Collect and analyze data to provide actionable outcomes for layout, design, or integration flow changes
- Achieve and improve yields impacted by design limitations, working with Probe, Yield Analysis, Test, and Reliability Engineering teams
- Ensure critical work, achievements, and goals are met while guiding resource utilization
Minimum Qualifications:
- MS in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
- 10 years of experience in Process Integration/Development or Package Integration within the semiconductor industry
- Strong architectural sense to translate process/design into technical requirements and specifications
- 10 years expertise in data extraction, analysis, and reporting tools such as JMP, Python, R
- In-depth understanding of process flows, interactions, and their effects on yield, performance, and reliability
- Technical knowledge and experience in Ultra-Thin Die Integration, Thermal Compression Bonding, Die to wafer, and Gap fill technology in a semiconductor environment
- Experience in various assembly processes like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures
Preferred Qualifications:
- Ph.D. or equivalent experience in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
- Experience with DRAM, HBM, NAND, 3D interconnects, or packaging technologies
- Proven leadership in a mentorship capacity
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.