Failure Analysis Engineer

Product Design Engineer, Yield & Quality

By joining the Product Engineering Failure Analysis Team, you will work with a world-class group to improve the advanced chip yield by identifying the root cause of chip failures.You will learn the most advanced failure analysis skills and tools to pinpoint critical physical or soft (electrical) failure root causes, thereby enhancing manufacturing robustness.

Job Description:

• Acting as an interface between cross functional teams for product failure root cause finding in leading-edge technology yield enhancement.
• Conducting electrical and physical characterizations and circuit-related analysis.
• Operating SEM/CAFM/FIB/Nano Probing/EMMI...etc FA tools and product layout study for fault isolation.
• Developing/Transfer new FA methodologies for future leading edge technologies production in Arizona.

Minimum Qualifications:

• Bachelor or above in Engineering or Science related. A background in EE, Physics, or Material Science is a plus.
• Experience and knowledge in PFA is preferred.
• Familiar SEM/TEM/FIB/Failure Analysis/Diagnosis is a plus.
• Exhibit good and open communication skills, be able to work within cross-functional teams.
• Good adaptability and flexibility, willing to work in a multi-culture environment and contribute to building a robust team.
• Strong problem solving skills, team spirit, active learning attitude that can deep dive in complex issue.
• Hands-on participation and a strong sense of ownership is required.
• Mission orientation, able to work under pressure and keep focus on problem solving.

Work Location: Phoenix, AZ

Training Location: Phoenix

Travel Percentage: As Required

Date: Apr 11, 2025

Country/Region: US

City: Phoenix

Company: TSMC Arizona