Sr BAW R&D Process Development Engineer
Apply NowCompany: Qorvo, Inc
Location: Richardson, TX 75080
Description:
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
Qorvo's BAW R&D Process Engineering team is seeking a talented CMP/wafer bonding engineer. The candidate chosen for this role will support the development of new BAW R&D technologies in these focus areas.
RESPONSIBILITIES:
Efficient teamwork for BAW R&D process development, equipment startup, qualification and training
Continuous process improvement that enables new technologies, increases yield, and throughput
Communication of development to Process Integration and Manufacturing
Commitment to change control and quality processes
Definition of new in-line metrics as needed to support new process technologies
Current focus areas for this position include:
CMP (Oxide and Cu Polish, clean), Wafer Bonding (Fusion, Hybrid)
Advanced Process Control / Feed-forward and Feed-back model building
QUALIFICATIONS:
Bachelor's degree in Materials, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics or related field required.
5+ years' experience in semiconductor fabrication
Familiarity with fundamental principles of semiconductor layer fabrication, including upstream and downstream impacts to CMP process development (Oxide and Copper Polish, cleanup interactions), and Wafer bonding (Fusion or Hybrid Bonding)
Excellent communication skills for team-based problem solving
Ability to analyze technical results using statistics to estimate risk and reward
Familiarity with wafer-fab metrology equipment, failure analysis techniques, and statistical process control
Ability to manage multiple priorities and projects at once, with flexibility to adjust to changing demands
Position will demand a majority of the day working in a cleanroom environment
Preferred Qualifications:
MS or PhD preferred (less experience may be substituted for higher level degree)
This position is not eligible for visa sponsorship by the Company.
#LI-KR1
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.
Qorvo's BAW R&D Process Engineering team is seeking a talented CMP/wafer bonding engineer. The candidate chosen for this role will support the development of new BAW R&D technologies in these focus areas.
RESPONSIBILITIES:
Efficient teamwork for BAW R&D process development, equipment startup, qualification and training
Continuous process improvement that enables new technologies, increases yield, and throughput
Communication of development to Process Integration and Manufacturing
Commitment to change control and quality processes
Definition of new in-line metrics as needed to support new process technologies
Current focus areas for this position include:
CMP (Oxide and Cu Polish, clean), Wafer Bonding (Fusion, Hybrid)
Advanced Process Control / Feed-forward and Feed-back model building
QUALIFICATIONS:
Bachelor's degree in Materials, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics or related field required.
5+ years' experience in semiconductor fabrication
Familiarity with fundamental principles of semiconductor layer fabrication, including upstream and downstream impacts to CMP process development (Oxide and Copper Polish, cleanup interactions), and Wafer bonding (Fusion or Hybrid Bonding)
Excellent communication skills for team-based problem solving
Ability to analyze technical results using statistics to estimate risk and reward
Familiarity with wafer-fab metrology equipment, failure analysis techniques, and statistical process control
Ability to manage multiple priorities and projects at once, with flexibility to adjust to changing demands
Position will demand a majority of the day working in a cleanroom environment
Preferred Qualifications:
MS or PhD preferred (less experience may be substituted for higher level degree)
This position is not eligible for visa sponsorship by the Company.
#LI-KR1
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.