Manufacturing Engineer

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TITLE: Manufacturing Process Engineer

DEPARTMENT: Package Sensor Solutions Engineering

Essential Functions (Responsibilities)

• Responsible for the development and continuous improvement of manufacturing assembly processes of MEMS pressure sensors
• Responsible for developing MEMs assembly processes for both production and for engineering prototypes in response to customer design requirements eg wirebonding, die attach, overmolding, encapsulation etc and corresponding materials selection
• Drive product yield improvement and throughput capacity optimization using Lean Manufacturing and Six Sigma methodologies.
• Develop, design and introduce improved tooling and /or equipment where appropriate.
• Develop concepts for flexible assembly and test platforms within the multi-disciplinary Engineering team.
• Approximately 10% of work conducted in an Class 1000 assembly room environment.
• Availability to travel in the US and overseas where needed.

Qualifications / Requirements

• Bachelors Degree in Engineering discipline or related field (or high school diploma/GED and 5 years experience as a manufacturing engineer in a semiconductor industry environment)
• Minimum 2 years engineering experience in high-volume manufacturing.
• Proven experience of common IC Packaging techniques including wirebonding, die attach, encapsulation techniques, materials selection and micro packaging equipment used in MEMS-based process development.
• Working knowledge of Design of Experiments (DOE), Failure Mode & Effect Analysis (FMEA), Production Control Plans & Statistical Process Control (SPC).
• Demonstrated success with automotive or medical product development
• Ability to work in a clean room environment including wearing required clean room attire and safety equipment.
• Proficiency in Microsoft office applications (Word, Excel, PowerPoint, Project, Access)
• For consideration please submit your candidacy online
  * You must be 18 years or older, willing to take a drug test, submit to a background investigation and have unrestricted authorization to work in the United States.
  * You must be willing to work out of an office located in Fremont, CA.
  * If currently an Amphenol employee, you must have been in your current position for at least 12 months and have at least a satisfactory performance rating (e.g. Highly Valued)

Desired

• Six Sigma Quality Experience (Green Belt Certified)
• Experience with workstation layout & design and ergonomic principles.
• Experience working with new product introduction and project management.
• Experience with Integrated Circuit manufacturing and assembly techniques.
• Strong written communication skills - able to write clear and concise reports.
• Strong verbal communication skills - ability to communicate effectively with employees at all levels of the organization.
• Excellent team player with proven record of working across multiple projects and teams
• Capable of working with internal and external teams
• Knowledge of MEMS products and processes
• Experience working with MEMS and/or pressure sensor testing techniques.
• Strong team player - demonstrated ability to work within a team and drive results.
• Self-motivated with the ability to meet strict deadlines.

General

• NovaSensor, an affiliate of Amphenol Sensors, offers a growth orientated, fast paced opportunity with a comprehensive benefit program.

NovaSensor is an affirmative action employer.

Please contact Katrina Manners at Katrina.manners@amphenol-sensors.com for more informat

Amphenol is an Equal Opportunity Employer / Disabled / Veterans

Other details

• Pay Type Salary
• Min Hiring Rate $90,000.00
• Max Hiring Rate $130,000.00
• Travel % 5
• Required Education Bachelor's Degree
• Job Start Date Monday, April 21, 2025

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